Structural characteristics of semi-automatic wafer laminating machine

Semi automatic wafer laminating machine is a common type, taking the product of Dongguan Fanghuixin Technology Co., Ltd. as an example, its structural characteristics are significant. The device comes in sizes of 6 inches, 8 inches, 12 inches, etc. (customizable) and is suitable for film application on products such as wafers, semiconductors, ceramics, and glass. It combines manual operation and automatic control, and the main body is made of stainless steel and aluminum alloy, with reliable quality and stable performance. It is suitable for BG film, UV film, blue film, etc. It is compatible with 12 inch and 8-inch screens and only requires replacement of the tray. Easy to operate, adjustable blade cutting position, ensuring no film fragments, no bubbles on the surface, no burrs on the edges, etc

Structural characteristics of single wafer laminate machine

The single wafer laminating machine also has unique structural features. Suitable for various film materials such as blue film, UV film, PET substrate film, and double-layer film. The optional configuration is a microporous film coating tray that can be applied to ultra-thin wafers. The microporous design, combined with unique gas path design and elastic support structure, can be applied to wafers, glass or ceramics with a thickness of up to 100um. The heated and elastic film sticking table is designed to adapt to wafers of different thicknesses. The pressure of the film sticking roller can be adjusted, and it is equipped with a circular knife and a cross cutting knife. It can also be optionally equipped with an ion wind rod electrostatic removal device, and has a small volume, belonging to the desktop placement type.

Working Procedure Principle

The working principle of a wafer mounter machine mainly includes the following key steps:

Wafer loading: The operator first places the wafer to be coated with film in the loading area of the wafer coating machine. The machine accurately positions the wafer on the coating station through an automated device, which is the foundation of subsequent operations.

Positioning and Calibration: Using a high-precision positioning system to accurately align the wafer and ensure the accuracy of the film placement is crucial for ensuring the precision of subsequent processes.

Film sticking operation: After the wafer positioning is completed, the film sticking machine automatically cuts off the protective film from the film roll and accurately attaches it to the surface of the wafer. During the film application process, the machine controls the tension, speed, and position of the film to ensure the stability and consistency of the film quality.

Wafer Unloading: After the film is applied, the wafer laminating machine automatically unloads the coated wafer from the workbench and transfers it to the next process step.

Principle of functional manifestation

The working principle can also be reflected from its function, as it completes the film sticking operation quickly and accurately through automation. The reason why the film can provide protection for the wafer is that it can isolate the external environment from the influence of the wafer, prevent dust, impurities, and other possible pollutants from contacting the wafer, and ensure the purity of the wafer. The purity of the wafer is crucial for the performance and reliability of semiconductor products. At the same time, the automated film application process greatly improves production efficiency, avoiding the problems of low efficiency and susceptibility to human factors caused by manual film application. It also ensures that the position, tension, and speed of each film application are consistent, improving the stability of the entire production process and product consistency, reducing losses caused by wafer scratches, contamination, and other issues, as well as waste caused by human operation errors.